Job responsibilities:
Design testing and verification plans of our RF SoC products: bring-up of test chip and production chips, function verification, performance verification, …
Job responsibilities:
Based on product requirements, support RD to create test plan, and suggest testing platform Test program development and debugging Test hardware (Probe card, …
Responsible for Ethernet communication device designs such as Industrial Ethernet Switch, IoT, RTU, etc by using FPGA main chip. Main scope also include FPGA (such as Xilinx and …
Responsible for Ethernet communication device designs such as Industrial PoE Switch, IoT, RTU, etc by using FPGA main chip. Main scope also include FPGA (such as Xilinx and Intel …
類比電路開發設計與佈局優化(Bandgap, LDO, Charge Pump等類比電路) 非揮發性記憶體電路開發設計(Array, Decoding, Sense Amplifier等電路) 消費性、物聯網與車用電子之非揮發性記憶體電路整合開發設計 Our Design Team is responsible for NVM …
A new product concept is being developed, and you’ll provide input on technical challenges. As the concept takes shape, you will advise on PCB requirements and components in …
We are looking for 2D/2.5D/3D-IC thermal integrity design talent, who is well-experienced at thermal/mechanical design at standard package (HFCBGA/SiP) and advanced package …
We are looking for a EE engineer (7-10 yrs of experience) for our HW and Operation team in Taiwan. The ideal candidate should have the following technical skills and experience: …