IC package substrate design and layout 1.1. Package type includes flip-chip and wirebond. Single die design and multi-die design 1.2. Substrate layer count from 2 layers to 20+ …
Manage Silicon Foundry related operations for Infineon products, including new tape out (NPI) support and ramp-up of new products, tonsure on-time delivery with stable high yield …
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As a DRAM and Emerging Memory Quality and Reliability …
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Job Description As a MCT Assembly & Test …