External Manufacturing Engineer (PM)

Project leader for Resilience, Subcon Consolidation, Dual Source Qual, low cost project & responsible for strategic program portfolio in mass production environment. Leading cross site-functional core team and accountable for project deliverables, through Change Control Board (CAB) and IATF 16949 requirements. Responsibilities / Core Responsibilities • Manage transfer and consolidation program across external manufacturing sites. Develops milestones for the attainment of organization’s objectives on outsourcing strategy and supplier performance management. • Project owner and contact window, accountable for overall schedule and deliverables. Manage cross functional project team with clear roles and responsibility, define actions ownership in execution time plan. • Leading project team through technical gap analysis, design rules verification, risk assessment / mitigation, and actions follow-up till closure. Drive for total solutions, first pass qualification success, POR robustness and manufacturing integration per timeline. • Collaborates with other functional organizations (e.g., Commercial, Business Unit, Quality, Supply Chain & etc.) on defining business case, qualification plan, customer PCN requirement, capacity / equipment transfer strategy, product End of Life (EOL), and Last Time Buy (LTB) as part of project elements. • Control project communications and reporting. Perform periodical project review with core team, initiate phase gate review and approval / alignment with stakeholders. • Administrative function of CRM (Change Request Management), review and facilitate change request control through external manufacturing organization. • Support quality audit at external manufacturing sites, or qualification process audit prior to production release as part of ramp readiness gate in project plan. • Other job-related functions as required Job Qualifications • Bachelor’s degree in engineering or equivalent technical background. • Minimum 8 years of experience in semiconductor IC manufacturing environment, with hands on exposure from Process or Packaging engineering in Assembly/Test. • Knowledge and track records of cross site-functional program management, team leadership, technical writing with presentation, self-driven and discipline. • Certified PMP will be an added advantage.