類別: 半導體工程師

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip) 1.Package RFQ and …

1.半導體、面板、設備商或化工廠，氣體化學運轉3年以上相關運轉、擴充工程及系統改善經驗 2.運作設備相關經驗大於五年亦可 3.有現場管理經驗優先 【Responsibilities and Tasks】 Maintenance, Design, and Construction •Provide system designs for safe …

JOB DESCRIPTION: Micron’s Assembly Package Technology Development team is looking for a motivated and experienced individual contributor for this position in Process Development …

JR71909 ENGINEER, WORKFORCE DEVELOPMENT As a Workforce Development (WD) Engineer, you will be accountable for managing Front-end manufacturing related trainings. You are encouraged …

Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/Sr-Engineer--PDE-Technology-Development_JR49904-1 Job Description Summary Micron’s Assembly …

As a Industry 4.0 (I4.0) Analyst at Micron Technology, Inc., you will report to the Smart Manufacturing and Artificial Intelligence organization. The team defines, drives and …

Micron Technology operates in a highly competitive industry where innovation depends on hardworking minds extracting fresh insights from an ever-expanding data universe. We are …

As Physical Failure Analysis (PFA) Engineer for Micron Taiwan (MTB), you will be providing full failure analysis support for qualifications, customer returns, new device …