類別: 半導體工程師

This role will lead the Package Design Project with R&D team members and deliver advanced and innovative packaging resolutions to clients. (Flip-Chip) 1.Package RFQ and …

【本職缺優先審核至高通官網投遞人選】請至高通官網上傳英文履歷表: https://qualcomm.wd12.myworkdayjobs.com/External/job/Hsinchu-City-TWN/SRAM-Characterization-and-Modeling-Engineer_3078557 【Talents who apply job …

【本職缺優先審核至高通官網投遞人選】請至高通官網上傳英文履歷表https://careers.qualcomm.com/careers/job/446705989572 【Talents who apply job through Qualcomm Career Website will be reviewed and considered as top …

Responsibilities • Products Demonstration and Technical Sales Consulting: o Measuring, reporting and presenting the valuable results on customer samples o Planning and conducting …

1.半導體、面板、設備商或化工廠，氣體化學運轉3年以上相關運轉、擴充工程及系統改善經驗 2.運作設備相關經驗大於五年亦可 3.有現場管理經驗優先 【Responsibilities and Tasks】 Maintenance, Design, and Construction •Provide system designs for safe …

As Physical Failure Analysis (PFA) Engineer for Micron Taiwan (MTB), you will be providing full failure analysis support for qualifications, customer returns, new device …

Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process …

Responsibilities: Establish and improve DIFF/IMP process condition and technology. Upgrade process capability and reduce production cost. Establish and modify process management …