Signal integrity analysis, optimization, and channel risk assessment Simulation flow development and improvement Develop PCB SI/PI simulation methodology and analysis flow Provide …
一、負責產品概念設計和開發直到大量生產 二、與跨部門團隊合作,使用不同技術為產品技術方向定義,包括WiFi、BLE、5G、GPS等 三、負責解決包括產品架構上問題, 包括效能、功耗、温度工况; 開發方面,包括原理圖設計、PCB佈局設計和整體系統等問題,協助跨部門及時更新產品最新資訊及與內部研發合作確保產品生產規格及品質符合要求
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Job responsibilities:
Design testing and verification plans of our RF SoC products: bring-up of test chip and production chips, function verification, performance verification, …
This opportunity is for a Product Engineer in the Digital and Signoff Group (DSG) at Cadence. The Cadence Digital and Signoff Group will offer you a dynamic environment in which …
The company creates an international environment and welcomes foreigners to join the company .
Feasibility assessment of new projects Draw production drawings Part material review …
1.Tapeout with multi-million gates count SOC design on cutting-edge technologies. 2.Develop UDSM design methodology for timing/power/reliability/DFM closures and low power designs. …
Analysis and development of battery optimization algorithms Collaborate with the Backend team to implement and improve all the components related to the management of the …