【GQ】ENGINEER/ SENIOR ENGINEER - DEMQRA HPM (High Performance Memory) 產品品質與可靠度工程師
As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Performance Memory (HPM) Engineer at Micron Technology, Inc., your primary responsibility will be establishing quality criteria and monitoring quality indices based on FE and BE signals from NPI to high-volume manufacturing (HVM). You will define, lead and drive key action to bring Micron product quality to be the best in class and to prevent quality and reliability related issues.
You will be driving the following: • Work with stakeholders to define, deploy and monitor outgoing quality and reliability (OQR) metrics base on FE and BE production signals as well as reliability test results • Partner with package development engineer and product engineer on latest products and technologies to define quality and reliability fail modes • Proactively work to evaluate, characterize, and mitigate Quality and Reliability risks and fail modes for BE new products and HVM • Partner with MFG Quality Assurance and Quality Engineer teams on current HVM products to sustain and further develop the quality reliability (QR) fail mode list • Work with key teams to define and validate OQR specs and to mitigate known and potential Quality and Reliability risks • Dispo deviation material based on production signals and reliability test results with quick turn around time to dispo • Maintain and facilitate the best possible communication between Process Integration, Product Engineering and Quality Teams for key Quality and Customer issues • Partner with Process Integration, Process and Equipment Engineering, Product Engineering, and 8D teams to find root cause and Corrective Action Preventive Actions • Provide qualification plan, review and release of qualification
Education: • M.S. in EE, Materials Science, Semiconductor Engineering or related field of study
Required Qualifications: • Familiarity with semiconductor wafer fabrication, advanced packaging, and semiconductor device physics. • Strong knowledge of Assembly processes, tools, failure modes and Chip-to-Package issues and concerns • Knowledge of failure analysis and relevant characterization techniques at package and silicon levels. Especially for products using multiple chips per package • Extensive knowledge of stress/strain relevant to materials, silicon, packages, etc, the associated failure modes, characterization. and modeling techniques • Meticulous experiment design and data analysis skills, including theoretical and statistical applications. • Multi-tasking and analytical skills with demonstrated success at solving highly complex problems and leading cross-functional projects
Preferred Qualifications: • Proficiency with Microsoft Office applications • Familiarity with Perl, C++, Python, HTML, CGI, or Java