G240079-3D-IC Thermal/Mechanical Staff/Manager

We are looking for 2D/2.5D/3D-IC thermal integrity design talent, who is well-experienced at thermal/mechanical design at standard package (HFCBGA/SiP) and advanced package (CoWoS/InFO/SoIC), for ASIC electronic system co-optimization. Thermal modeling & hotspots simulation for whole system architecture, including SoC, APT, SBT, PCB, and heat dissipation modules. Thermal models extraction and design-optimization at 2D/2.5D/3D-IC for tape-out/sign-off. Support thermal issues & solutions development at CP / FT / Reliability system. Design of experiments and correlation for thermal & mechanical designs at ASIC & Package. Research on materials and advanced heat management solution & implementation.