Sr/Engineer (Wire Bond), PDE Technology Development
Apply Here: https://micron.wd1.myworkdayjobs.com/External/job/Taichung---Fab-16-Taiwan/Sr-Engineer--PDE-Technology-Development_JR49904-1
Job Description Summary Micron’s Assembly Package Technology Development (TD) Team is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (Front End , Bonding and Back End) for Micron’s memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data daily, responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working side by side with Design teams (Globally) and you will be involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An important topic is the path finding of innovative package technology : Deep fundamental understanding of the key risks in Bumping and Flip chip technologies. Actual experience with FOP(Fan Out Package) and WLCSP is a plus. Finally the hands on integration experience in Pkg Assembly and WL package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems.
Job Responsibilities:
Primarily responsible for Cleanroom 2 (CR2) Area processes (Die / Wire Bond). Development and Qualification of new direct and indirect materials, new equipment and new wafer tech nodes for Micron’s new products and devices. Ensure product quality and process performance, and develop projects geared towards cost reduction, productivity, risk mitigation, and resolving manufacturing challenges. Lead/collaborate with cross function team/site, to ensure successful development transfer to all Micron’s network sites. Familiarize and implementation of PMI (Product Maturity Index) methodology & provide proper Documentation for product transfer
Job Requirements: Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required Experienced in Semiconductor Backend assembly processes. At least 3 years’ experience in semiconductor industry with proven knowledge and skillset in Cleanroom 2 (CR2) Area processes (Die Attach / Wire Bond) Excellent problem-solving skill, familiar with data driven analysis, statistical analysis and data interpretation skillset. Ability of multi-tasks and strong project management skills to ensure execution to timelines Ability to integrate & cooperate with people from cross function teams to understanding of business needs and customers’ requirement.