Thermal Engineer, Staff level (Hsinchu)(3073571)(3074800)

【本職缺優先審核至高通官網投遞人選】請按照產品類別上傳英文履歷表： Automotive: https://careers.qualcomm.com/careers/job/446704844232 Server: https://careers.qualcomm.com/careers/job/446705357827 General Summary: Qualcomm’s Hardware Systems organization is seeking a Thermal Engineer to join our Taiwan team. The qualified individual will be creating innovative solutions resolving complex thermal management challenges supporting Automotive/Server applications. He or she will apply analytical and empirical skills on the development of advanced thermal architecture solutions for Automotive chipsets and their hosting platforms. Responsibilities: • Perform package and system-level thermal modeling to design best in class thermal solutions. • Support thermal/mechanical projects from concept to production phases. • Design, set up, run, and deliver results for various thermal experiments to validate performance of hardware. • Manage technical projects and collaborate with other internal organizations and OEMs/ODMs to support the execution process throughout development cycle. • Perform thermal simulations and tests and prepare and present results to stakeholders from various disciplines.